The platform provides fast, accurate DC analysis for IC packages and PCBs with integrated thermal and electro-thermal co-simulation, supporting both pre-layout planning and post-layout validation to identify IR drop, current density, and thermal risks early.
Features like sense line optimization and simplified DRC verification, combined with high-speed simulation, help prevent field failures and enable cost-effective, schedule-friendly design improvements.
Fast, system-level IR drop and PDN analysis identifies hotspots, resistance issues, and VRM optimization needs using electro-thermal simulation and SPICE modelling.
PowerTree-driven workflows and Voltus integration enable early validation, quick ECO updates, and reduced risk, cost, and delays.
Features
Electrical and thermal co-simulation
Sigrity PowerDC unifies electrical and thermal co-simulation to model current–temperature effects, verify voltage and thermal limits, and streamline DC/thermal analysis with easy setup, visualization, and design optimization.
Managing system-level IR drop
System-level IR drop analysis is vital for high-performance designs to control DC losses and maintain tight voltage tolerances as currents rise. Tool provides fast, accurate simulations across complex geometries and voltage domains, with clear visualization and post-layout DRC checks.
Optimizing voltage regulator module (VRM) settings
Sigrity PowerDC optimizes VRM remote sense placement with automated selection of the best sense line location, improving voltage margin and minimizing IR drop. The product also balances currents, supports multiple VRMs, and guides safe adjustment of nominal output voltage for effective compensation.
Realistic assessment of critical structure
Dense, cutout-heavy power structures demand accurate analysis to avoid issues like overheated neck-downs and fuse-like vias. The tool models real materials and geometries with electro-thermal co-simulation to capture true current and temperature effects.
Multi-structure analysis
Multi-structure analysis enables simple electrical and electro-thermal co-simulation of multi-board systems, streamlining setup and reducing analysis time. The solution consolidates detailed results from each block into a single signoff-ready report for efficient system-level DC verification.