- AWR Solutions
Discover Our AWR Solutions
The AWR Design Environment Platform is a fully integrated solution for RF and microwave product development, combining high-frequency circuit design, system simulation, and in-design electromagnetic (EM) and thermal analysis within a single, streamlined environment. It accelerates development cycles by enabling engineers to move seamlessly from concept to manufacturing-ready designs with enhanced accuracy, productivity, and reduced turnaround time.
With a unified schematic and layout flow, advanced nonlinear harmonic balance and circuit envelope simulation, and comprehensive EM/thermal co-analysis across chip, package, and PCB, the platform ensures precise performance prediction and robust design validation. Built-in yield analysis, optimization capabilities, and direct tape-out support for GDSII, DXF, and Gerber formats along with interoperability with Cadence Virtuoso and Allegro X enable efficient, manufacturing-ready RF and microwave solutions.
Microwave Office Linear
Microwave Office Linear empowers engineers to design and analyze high-frequency RF and microwave circuits with precision and speed. It supports both passive and small-signal
Microwave Office PCB
Microwave Office PCB delivers advanced linear and nonlinear RF design capabilities powered by the Cadence APLAC Harmonic Balance simulator. It enables accurate analysis of highly nonlinear circuits such as power amplifiers, mixers
Microwave Office MMIC
Microwave Office MMIC provides a complete front-to-back MMIC design flow, seamlessly integrating schematic entry, simulation, and physical layout within a unified environment. It enhances productivity and first-pass success with comprehensive PDK support
VSS System
VSS System enables rapid design and evaluation of virtual 5G/6G, IoT, radar, and EW systems, allowing teams to explore new architectures and analyze both component-level and end-to-end performance.
Microwave Office Add-Ons
Microwave Office Add-Ons Options extend EM, thermal, and nonlinear simulation capabilities to support accurate 3D modelling,